MULTICOMP PRO MP700356 Datasheet & Stock

Polyimide film and silicone adhesive designed for high temperature masking applications.




Mask for protection of gold fingers of PCB during wave solder or solder dip process

Release surface in fabrication of parts cured at elevated temperatures

Widely used for electrical insulation on transformers, motor, coils, PCBs

Thin and conformable enabling masking of uneven surfaces

Wide operating temperature range up to 500°F

Excellent electrical insulation

Removes cleanly without adhesive residue after exposure to heat/chemical

Meets UL-94V0

Film thickness (polyimide) 2.0mil, 3.5mil total thickness