CHEMTRONICS 60-5-10 Datasheet & Stock

The 60-5-10 is a Soder-Wick® No Clean Desoldering Braid designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick® No Clean uses pure, oxygen-free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-Wick® No Clean SD is available on ESD safe bobbins for protection against damage due to static electricity. The Soder-Wick® No Clean SD safely removes solder in all applications requiring type ROL0 flux. BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes. The Soder-Wick® No Clean safely removes solder from micro circuits, surface mount device pads, ball grid array pads, lugs and posts.




Brown label on SD bobbin

Minimizes the risk of damage associated with static electricity

Patented non-corrosive, halide-free and organic no-clean flux

Desolders up to 40% faster than competitive no-clean braids and leaves boards cleaner

Requires little or no post solder cleaning

No corrosive residues

Minimal risk of heat and static component damage

Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for surface insulation resistance

Packaged in ESD-safe static dissipative bobbins





Applications


Maintenance & Repair